SM320F28335-HT

高温数字信号控制器

制造商:TI

产品信息

描述 The SM320F28335 is a highly integrated, high-performance solution for demanding control applications.Throughout this document, the device is abbreviated as F28335.特性 High-Performance Static CMOS Technology Up to 150 MHz for TC = –55°C to 125°C and Up to 100 MHZ for TC = 210°C1.9-V Core, 3.3-V I/O DesignHigh-Performance 32-Bit CPU IEEE-754 Single-Precision Floating-Point Unit (FPU))16 × 16 and 32 × 32 MAC Operations16 × 16 Dual MACHarvard Bus ArchitectureFast Interrupt Response and ProcessingUnified Memory Programming ModelCode-Efficient (in C/C++ and Assembly)Six Channel DMA Controller (for ADC, McBSP, ePWM, XINTF, and SARAM)16-bit or 32-bit External Interface (XINTF) Over 2M × 16 Address ReachOn-Chip Memory 256K × 16 Flash, 34K × 16 SARAM1K × 16 OTP ROM Boot ROM (8K x 16) With Software Boot Modes (via SCI, SPI, CAN, I2C, McBSP, XINTF, and Parallel I/O)Standard Math TablesClock and System Control Dynamic PLL Ratio Changes SupportedOn-Chip OscillatorWatchdog Timer ModuleGPIO0 to GPIO63 Pins Can Be Connected to One of the Eight External Core InterruptsPeripheral Interrupt Expansion (PIE) Block That Supports All 58 Peripheral Interrupts128-Bit Security Key/Lock Protects Flash/OTP/RAM BlocksPrevents Firmware Reverse EngineeringEnhanced Control Peripherals Up to 18 PWM OutputsUp to 6 HRPWM Outputs With 150 ps MEP ResolutionUp to 6 Event Capture InputsUp to 2 Quadrature Encoder InterfacesUp to 8 32-bit/Nine 16-bit TimersThree 32-Bit CPU TimersSerial Port Peripherals Up to 2 CAN ModulesUp to 3 SCI (UART) ModulesUp to 2 McBSP Modules (Configurable as SPI)One SPI ModuleOne Inter-Integrated-Circuit (I2C) Bus12-Bit ADC, 16 Channels 80-ns Conversion Rate2 × 8 Channel Input MultiplexerTwo Sample-and-HoldSingle/Simultaneous ConversionsInternal or External ReferenceUp to 88 Individually Programmable, Multiplexed GPIO Pins With Input FilteringJTAG Boundary Scan SupportIEEE Standard 1149.1-1990 Standard Test Access Port and Boundary Scan ArchitectureAdvanced Emulation Features Analysis and Breakpoint FunctionsReal-Time Debug via HardwareDevelopment Support Includes ANSI C/C++ Compiler/Assembler/LinkerCode Composer Studio IDEDSP/BIOSDigital Motor Control and Digital Power Software LibrariesLow-Power Modes and Power Savings IDLE, STANDBY, HALT Modes SupportedDisable Individual Peripheral ClocksPackage Option Ceramic Pin Grid Array (GB) HLQFP (PTP)Temperature Range: GB Package: –55°C to 210°C (GB) PTP Package: –55°C to 150°C (PTP)APPLICATIONS Controlled Baseline One Assembly/Test Site One Fabrication Site Available in Extreme (–55°C/210°C) Temperature Range(1) Extended Product Life Cycle Extended Product-Change Notification Product Traceability Texas Instruments high temperature products utilize highly optimized silicon (die) solutions with design and process enhancements to maximize performance over extended temperatures.(1) Custom temperature ranges available

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