This ultrafast rectifier in the dual flag SO−8 flat lead package offersdesigners a unique degree of versatility and design freedom. The twodevices are electrically independent and can be used separately, ascommon cathode, as common anode or in series as a function of boardlevel layout. The exposed pad design provides low thermal resistance.The clip attach design creates a package with very efficient die size toboard area ratio. While thermal performance is nearly the same as theDPAK package height and board footprint are less than half

• New Package Provides Capability of Inspection and Probe After Board Mounting
• Low Forward Voltage Drop
• 175°C Operating Junction Temperature
• NRV Prefix for Automotive anD Other Applications Requiring Unique Site and Control Change Requirements; AEC−Q101 Qualified and PPAP Capable
• These are Pb−Free and Halide−Free Devices