LIS332AR
MEMS运动传感器3轴±2 g加速度计的模拟输出的超小型
制造商:
产品信息
The LIS332AR is a miniaturized low-power 3-axis linear accelerometer belonging to the "nano" family of ST motion sensors. It includes a sensing element and an IC interface to provide an analog signal to the external world.
The sensing element, capable of detecting the acceleration, is manufactured using a dedicated process developed by ST to produce motion sensors and actuators in silicon.
The IC interface is manufactured using a CMOS process that allows the design of a dedicated circuit which is trimmed to better match the sensing element characteristics.
The LIS332AR has a full-scale of ±2 g, and is capable of measuring accelerations over a maximum bandwidth of 2.0 kHz. The device bandwidth may be reduced by using external capacitors. The self-test capability allows the user to check the functioning of the sensor in the final application.
ST is already in the field with several hundred million sensors which have received excellent acceptance from the market in terms of quality, reliability and performance.
The LIS332AR is provided in a plastic land grid array (LGA) package.
Several years ago ST successfully pioneered the use of this package for accelerometers. Today, ST has the widest manufacturing capability and strongest expertise in the world for production of sensors in plastic LGA packages.
lis332ar是一种小型化低功耗三轴线性加速度计属于ST的运动传感器的“纳米”的家庭。它包括一个传感元件和一个集成电路接口,提供一个模拟信号到外部世界。
的传感元件,能够检测的加速度,是制造使用一个专门的过程中开发的由圣生产的运动传感器和致动器在硅。
IC接口是使用CMOS工艺,允许一个专用电路,修整,以更好地匹配传感元件特性的设计制作。
有一个全面的lis332ar±2克,可在测量加速度的最大带宽为2 kHz。使用外部电容器可以减少设备的带宽。自检功能允许用户检查传感器在最终应用程序的功能。
圣已经在该领域有几百个传感器,从质量,可靠性和性能方面获得了良好的接受,从市场上的。
lis332ar塑料栅格阵列(LGA)封装提供。
几年前,圣成功率先使用这个软件包的加速度计。今天,ST已经广泛的制造能力和世界上最强的塑料LGA封装的传感器生产技术。
Key Features
Single voltage supply operation
±2 g full-scale
High stability over temperature
Ratiometric output voltage
Power-down mode
Embedded self-test
10000 g high shock survivability
ECOPACK® RoHS and "Green" compliant
主要特点
单电压供电
2 g
高温稳定性
成比例的输出电压
掉电模式
嵌入式自测试
10000克高冲击生存能力
®Ecopack RoHS和“绿色”标准
电路图、引脚图和封装图
技术资料
应用案例
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